Potting and Encapsulation

Potting and encapsulating are two of the most popular applications for FRC ’s multi-component dispensing equipment. It is a common belief that everything in this world either contains a potted/encapsulated part or was made from a machine that contains a potted/encapsulated part.

What is the potting process?
Potting is the process of environmental protection by pouring a hardenable polymeric material into an electronic device, totally submersing and protecting the internal parts. The outer shell of the device holds the potting compound in place until it hardens.

What is the encapsulation process?
Encapsulation requires a mold in which the device is to be protected are placed, after which the hardenable polymeric material is injected to completely fill the mold. The device then takes on the shape after the compound hardens. Potting or encapsulating with a filler can modify dialectric strength, dissipate heat, allow the product to float in conjunction with waterproofing, and adding flexibility or rigidity to the product.

The reasons for potting/encapsulating are endless. Potting/encapsulation is also frequently used to protect a proprietary technology by completely covering an assembly in black epoxy resin – making it impossible to reverse engineer without damaging the proprietary component.

Still unsure if you need to pot or encapsulate your product?

Call us at 714.258.2350 and we’d be happy to discuss your needs.