Questions?
Potting and Encapsulation
Potting and encapsulating are two of the most popular designs for Fluid Research® Corporation’s multi-component dispensing equipment. It is a common belief that everything in this world either contains a potted/encapsulated part or was made from a machine that contains a potted/encapsulated part.
Potting is the process of pouring a composite material over an electronic component to enhance a desired feature. Encapsulating is the same; only the composite material is poured into a mold with the electronic component included.
Both are used synonymously and accomplish the same goal; your needs deciding whether you need to pot or encapsulate.Further Information
- Mold Filling
- Pumps
- Material Management Solutions
- Cartridge Filling
- Potting/Encapsulation
- Why Potting/encapsulating?
- Machines Designed To Pot/Encapsulate
- Filling Station
- Continuous Filling
- Syringe Filling
- Rapid Prototyping
- Doming
- Bonding/Sealing
- Material Management Unit
- Potting/Vacuum Encapsulation
- Signature Series
- PluraPaint Series
- Simplex Series
- Drum Ram Metering Systems
- Dispense Integration/Automation
- Doming Systems
- Progressing Cavity Pumps
- Advantage Series
- PluraShot Series
- When To Contract
- Contract Potting/Encapsulating