Potting and Encapsulation
Potting and encapsulating are two of the most popular applications for Fluid Research® Corporation’s multi-component dispensing equipment. It is a common belief that everything in this world either contains a potted/encapsulated part or was made from a machine that contains a potted/encapsulated part.
Potting is the process of environmental protection by pouring a hardenable polymeric material into an electronic device, totally submersing and protecting the internal parts. The outer shell of the device holds the potting compound in place until it hardens. Encapsulation requires a mold in which the device is to be protected are placed, after which the hardenable polymeric material is injected to completely fill the mold. The device then takes on the shape after the compound hardens.
Your needs direct whether to pot or encapsulate.Further Information
- Mold Filling
- Pumps
- Material Management Solutions
- Cartridge Filling
- Potting/Encapsulation
- Why Potting/encapsulating?
- Machines Designed To Pot/Encapsulate
- Filling Station
- Continuous Filling
- Syringe Filling
- Rapid Prototyping
- Doming
- Bonding/Sealing
- Material Management Unit
- Potting/Vacuum Encapsulation
- Signature Series
- PluraPaint Series
- Simplex Series
- Drum Ram Metering Systems
- Dispense Integration/Automation
- Doming Systems
- Progressing Cavity Pumps
- Advantage Series
- PluraShot Series
- When To Contract
- Contract Potting/Encapsulating