Why Potting or Encapsulating
Why do you want to pot or encapsulate your product? This is a valid question, however; the answer is not as easy.
From protection against airborne contaminants to moisture chemical corrosion, potting or encapsulating protects your electronic assembly while ruggedizing it against harsh environments. Potting/Encapsulating adds strength and integrity to your product.
Potting/Encapsulating with a filler can modify dialectric strength, dissipate heat, allow the product to float in conjunction with waterproofing, and adding flexibility or rigidity to the product. The reasons for potting/encapsulating are endless.
Potting/encapsulation is also frequently used to protect a proprietary technology by completely covering an assembly in black epoxy resin – making it impossible to reverse engineer without damaging the proprietary component.
Still unsure if you need to pot or encapsulate your product? Call us at 714.258.2350 and we’d be happy to discuss your needs.
If you have a small product run, Fluid Research® Corporation can perform your potting or encapsulating needs through our Contract Services Division.Further Information
- Mold Filling
- Pumps
- Material Management Solutions
- Cartridge Filling
- Potting/Encapsulation
- Why Potting/Encapsulating?
- Machines Designed To Pot/Encapsulate
- Filling Station
- Continuous Filling
- Syringe Filling
- Rapid Prototyping
- Doming
- Bonding/Sealing
- Material Management Unit
- Potting/Vacuum Encapsulation
- Signature Series
- PluraPaint Series
- Simplex Series
- Drum Ram Metering Systems
- Dispense Integration/Automation
- Doming Systems
- Progressing Cavity Pumps
- Advantage Series
- PluraShot Series
- When To Contract
- Contract Potting/Encapsulating