Liquid Dispensing Applications

At Fluid Research® we offer a wide variety of solutions to fit many different types of liquid dispensing applications. From our standard systems utilizing proprietary technologies, to fully customized, turnkey, and automated solutions. Below are examples of common application types.

Mold Filling

While hand-mixing material for your mold filling applications appears as an inexpensive solution, material waste and clean-up can be costly and dangerous to both your staff and environment. Calculating a return on investment, personnel hazards, uncertainty about mix ratios and exposure to potentially hazardous compounds must be factored into the equation. Although difficult to quantify, it has become clear through our experiences that we provide the superior alternative.

Potting and Encapsulation

Potting or encapsulation is performed for many reasons including preventing piracy, thermal conductivity, vibration reduction, environmental protecting and more. The process can include complete encapsulation of a device or filling voids within and enclosure.

Bonding

Bonding is the joining process in which a liquid or semi-liquid substance is applied to adjoining work pieces to provide a long-lasting bond. This process is highly useful in bonding materials together that cannot be welded. Adhesives used in bonding exist in many forms and can be made from various natural and/or artificial compounds.

Sealing

Similar to bonding, sealing is the process of joining a liquid or semi-liquid substance by applying material to adjoining work pieces to provide a long-lasting bond. The added benefit of sealing versus bonding is sealing prohibits contaminants from entering. From water to dust, sealing is one of the most efficient means to ensure a product does not become contaminated.

Solids Filled

Many of today’s potting and encapsulating materials are highly specialized in their intended use. Fillers such as quartz silica or aluminum oxide are often added for their thermally conductive properties for use in electronic devices that generate heat. Bonding or laminating material will often be filled with solid glass spheres to maintain bond line consistency. Bonding and structure adhesives filled with hollow glass spheres, often referred to as syntactics, are used to reduce weight when fabricating honeycomb panels in industries like aviation.

Regardless of your industry, Fluid Research® has high-quality, accurate and efficient systems catering to a wide variety of applications. With available customization and optional add-ons, finding the right solution for your business is simple. Get in touch with a Fluid Research® representative to learn more and check out our product offerings including single component systems, multi component systems and agitation material management.